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Thermal Simulation of Grain During Selective Laser Melting Process in 3D Metal Printing

Numan Habib1*, Muftooh Ur Rehman Siddiqi1 and Riaz Muhammad2

1CECOS University of IT and Emerging Sciences, Peshawar, Khyber Pakhtunkhwa, Pakistan; 2University of Bahrain, College of Engineering, Bahrain.

 
*Correspondence: Numan Habib, CECOS University of IT and Emerging Sciences, Peshawar, Khyber Pakhtunkhwa, Pakistan; Email: numanhabib@cecos.edu.pk

Figure 1:

Shows the simulation setup (a) step 1/16 (b) step 8/16 (c) step 16/16.

Figure 2:

(a) Peak temperature and temperature distribution in nickel (b) Peak temperature and temperature distribution in tungsten.

Figure 3:

Comparison of curves achieved in (Zhang et al., 2010) and the current study.

Figure 4:

SEM samples at vertical section at v = 110mm/sec, d = 0.05 mm, p = 100 watt (Yan et al., 2015).

Figure 5:
Temperature distribution on 1µm powder grain of Aluminum 7075 at 60 mm/sec scanning speed.
Figure 6:

The temperature at the focus point of 1µm diameter grain.

Figure 7:

The temperature at the focus point of 2µm diameter grain.

Figure 8:

The temperature at the focus point of 3µm diameter grain.

Journal of Engineering and Applied Sciences

December

Vol. 42, pp. 01-48

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