Thermal Simulation of Grain During Selective Laser Melting Process in 3D Metal Printing
Numan Habib1*, Muftooh Ur Rehman Siddiqi1 and Riaz Muhammad2
1CECOS University of IT and Emerging Sciences, Peshawar, Khyber Pakhtunkhwa, Pakistan; 2University of Bahrain, College of Engineering, Bahrain.
*Correspondence: Numan Habib, CECOS University of IT and Emerging Sciences, Peshawar, Khyber Pakhtunkhwa, Pakistan; Email: numanhabib@cecos.edu.pk
Figure 1:
Shows the simulation setup (a) step 1/16 (b) step 8/16 (c) step 16/16.
Figure 2:
(a) Peak temperature and temperature distribution in nickel (b) Peak temperature and temperature distribution in tungsten.
Figure 3:
Comparison of curves achieved in (Zhang et al., 2010) and the current study.
Figure 4:
SEM samples at vertical section at v = 110mm/sec, d = 0.05 mm, p = 100 watt (Yan et al., 2015).
Figure 5:
Temperature distribution on 1µm powder grain of Aluminum 7075 at 60 mm/sec scanning speed.
Figure 6:
The temperature at the focus point of 1µm diameter grain.
Figure 7:
The temperature at the focus point of 2µm diameter grain.
Figure 8:
The temperature at the focus point of 3µm diameter grain.